JPH0713237Y2 - 光検出装置 - Google Patents

光検出装置

Info

Publication number
JPH0713237Y2
JPH0713237Y2 JP12190089U JP12190089U JPH0713237Y2 JP H0713237 Y2 JPH0713237 Y2 JP H0713237Y2 JP 12190089 U JP12190089 U JP 12190089U JP 12190089 U JP12190089 U JP 12190089U JP H0713237 Y2 JPH0713237 Y2 JP H0713237Y2
Authority
JP
Japan
Prior art keywords
semiconductor substrate
strain
photosensitive element
photodiode
pedestal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP12190089U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0361356U (en]
Inventor
公夫 藤川
親男 原田
Original Assignee
コーリン電子株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by コーリン電子株式会社 filed Critical コーリン電子株式会社
Priority to JP12190089U priority Critical patent/JPH0713237Y2/ja
Publication of JPH0361356U publication Critical patent/JPH0361356U/ja
Application granted granted Critical
Publication of JPH0713237Y2 publication Critical patent/JPH0713237Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48092Helix

Landscapes

  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
JP12190089U 1989-10-18 1989-10-18 光検出装置 Expired - Fee Related JPH0713237Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12190089U JPH0713237Y2 (ja) 1989-10-18 1989-10-18 光検出装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12190089U JPH0713237Y2 (ja) 1989-10-18 1989-10-18 光検出装置

Publications (2)

Publication Number Publication Date
JPH0361356U JPH0361356U (en]) 1991-06-17
JPH0713237Y2 true JPH0713237Y2 (ja) 1995-03-29

Family

ID=31669922

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12190089U Expired - Fee Related JPH0713237Y2 (ja) 1989-10-18 1989-10-18 光検出装置

Country Status (1)

Country Link
JP (1) JPH0713237Y2 (en])

Also Published As

Publication number Publication date
JPH0361356U (en]) 1991-06-17

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees